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Electronics Enclosures Thermal issues

Indian Institute of Technology Bangalore , NPTEL and Indian Institute of Science Bangalore via Swayam


Electronics Design is understood as analysis and implementation at various levels from large systems installation to chip design. One of the aspects is failure due to temperature effects is constantly under study. Theory of Heat transfer has been understood and explained way back in 1700. Rigor and precision has resulted in seemingly complicated ‘equations’.
In the design of enclosures, managing heat is (relatively) well understood. Empirical results can be used to optimise the layout and reduce failure. Practices in use of heat management hardware are available from specialist manufacturers and can be used. This course is an attempt to familiarise the participating registrants with heat related issues in Design of Electronic Product enclosures.
  • Registrants to BSc, BE, B.Tech, MSc and ME, M.Tech courses,
  • Product design engineers (in related industry)
  • Product Managers
PREREQUISITES :12th Standard
INDUSTRY SUPPORT :Electronics and Mechanical involved in enclosure Design



1. Introduction to Enclosures and thermal issues2. Basics of conductive heat transfer3. Radiation at normal ambient4. Convection basics5. Forced convection6. Combined modes
7. Use of Conduction in enclosures8. Radiation as a speciality9. Convective cooling in small products10. Forced cooling in medium and large systems11. Liquid cooled high power modules12. Novelty phase change and thermo electrics13. Refrigerated cabinets
14. Heat sinks practical application15. Blowers, fans, ventilations of systems16. Instrumentation for measurement17. Effects on sealed enclosures
18. Integration of ID with the heat aspects19. Case stories in biological instruments20. Case study of select participants’ work21. Application of Thermal CAD and round up

Taught by

NV Chalapathi Rao

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