The course is intended to provide an understanding of current fabrication practices used in the semiconductor industry, along with the challenges and opportunities in device fabrication. It caters to UG and PG students from diverse backgrounds such as Chemical, Electrical, Mechanical, Metallurgy, Materials Science, Physics, and Chemistry. The course provides an overview on the integrated circuit fabrication along with practices and challenges to continue to satisfy Moore’s law.
INTENDED AUDIENCE: Engineering and Science students at the UG and PG levelINDUSTRY SUPPORT: Semiconductor device fabrications companies such as TSMC and Applied Materials will value this course
COURSE LAYOUT This is a four week course, which deals with the various steps involved in integrated circuit fabrication, starting with silica, which is the raw material for making silicon wafers. The course contents are divided into four weeks as per the plan below.
Week 1: Introduction and overview of semiconductor device fabricationWeek 2: Fabrication operations: Oxidation, doping, and lithographyWeek 3: Fabrication processes: etching and growth. Process evaluationWeek 4: Process yield, clean room design, and IC logic and packaging
Lectures videos are available for each week and there will be an assignment at the end of the week. Along with this, optional additional reading material will also be available. Some of the alternate fabrication techniques, especially printed electronics, will be included in this reading material.
Prof. Parasuraman Swaminathan