Beyond ORv3 HPR Busbars: Enabling Next Gen AI Rack Power Levels with Liquid Cooling

Explore a 14-minute conference talk from the Open Compute Project where Hal Loket, System Architect at TE Connectivity, discusses how liquid cooling technology can revolutionize busbar performance for AI infrastructure. Learn how the increasing power demands of AI workloads are pushing current busbar technology to its limits and how liquid-cooled busbar designs offer a solution without increasing physical footprint. The presentation explains how these innovative liquid-cooled designs leverage existing cooling infrastructure to significantly increase current carrying capacity beyond what's possible with traditional 48V ORv3 air-cooled solutions, enabling side car architecture at ORv3 48V power levels and supporting the most demanding AI workloads and latest chip designs.