Learn about cutting-edge High Bandwidth Memory (HBM) packaging technology in this technical presentation from SK hynix's Team Leader Kwon Jong-oh at SK AI SUMMIT 2024. Explore how SK hynix's proprietary MR-MUF technology has evolved from 3rd generation HBM2E to 5th generation HBM3E, enabling the development of ultra-high-density 16Hi HBM products. Discover how Advanced MR-MUF technology builds upon 12Hi Stack capabilities to achieve world-first 16Hi HBM implementation, positioning SK hynix as a leader in the competitive AI memory market where tech giants demand faster and higher-density memory solutions. Gain insights from Kwon's 20+ years of TSV technology expertise and understand how these innovations are crucial for meeting the growing demands of the generative AI market, which requires increasingly sophisticated memory solutions for processing large amounts of data at higher speeds.
Overview
Syllabus
업계 최고 용량 HBM 제품 구현을 위한 16Hi HBM PKG 기술 | SK하이닉스 권종오
Taught by
SK AI SUMMIT 2024