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Introducing the HIGHER Project: European Data Center-Ready Technologies for Hardware Modularity

Open Compute Project via YouTube

Overview

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This keynote presentation introduces the HIGHER project, which is developing Europe's first datacenter-ready processors and management modules for cloud and edge infrastructures using European technologies and OCP specifications. Join Vincent Casillas (SiPearl - VP R&D System and Software) and Tim Lewis (Insyde Software - CTO) as they share their journey of open collaboration with OCP MHS, OAI, and DC-SCM standards, integrating a RISC-based server management module with advanced AI/HPC acceleration—exemplified by the OCP-contributed NVIDIA MGX NVL72 platform. Learn how SiPearl, designer of Europe's high-performance, energy-efficient HPC/AI processor, together with Insyde Software demonstrates how advanced system firmware enables seamless hardware modularity. Discover how unified boot, device management, and peripheral access create a flexible execution environment for next-generation cloud and edge infrastructures, and explore how European technology leaders and OCP are shaping an EU-based open data center ecosystem.

Syllabus

Introducing the HIGHER project

Taught by

Open Compute Project

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