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NPTEL

Manufacturing Process Technology - II

NPTEL and Indian Institute of Technology Kanpur via YouTube

Syllabus

Introduction - Manufacturing Process Technology - Part-2 - Prof. Shantanu Bhattacharya.
Introduction to Advanced Machining Processes.
Classification of Machining Processes.
Silicon growth & Crystallography.
Micro Fabrication Technology.
Photolithography.
Soft Lithography.
Introduction of Additive Techniques.
Introduction to Abrasive Jet Machining Process.
Introduction to Wet Etching Techniques.
Introduction to Dry Etching Techniques.
Determination of MRR of Ultrasonic Machining Process.
Ultrasonic Machining Process.
Mechanics of Ultrasonic Machining (USM).
Effect of Process parameters of USM.
Ultrasonic Machining Unit.
Electrochemical Machining Processes (ECM).
Material Removal Rate of ECM.
Electrode Double Layer.
Material removal rate of an alloy in ECM.
Kinematics and Dynamics of ECM.
Temperature and Pressure rise during ECM.
Determination of Electrolyte flow velocity in ECM.
Effect of heat and Hydrogen bubble generation during ECM Process.
Theoretical determination of Tool shape.
Design for Electrolyte flow in ECM.
Introductions of Electro-chemical Drilling Process.
Introduction to Finishing Process.
Electric Discharge Machining Process.
EDM part-2.
Effect of various process parameters on EDM process.
Analysis of RC circuit for EDM.
Electrodischarge machining sytem.
Effect of various parameters on EDM Process.
Tool Electrodes and Dielectric fluids & Electron Beam Machining.
Functional Characteristics of EBM Process Edit Lesson.
Introduction of Laser Beam Machining Process.
Material removal rate of LBM.
Heat conduction and Temperature rise during LBM.
Modelling of LBM processes.
Metal forming Processes Edit Lesson.
Yield Criterion used in Metal Forming Processes Edit Lesson.
Concept of Principal stress, strain.
Fused Deposition Modeling Process.
Rolling Process part-2.
Trescas' Yield criteria & Rolling Process.
Rolling Processes.
Additive Manufacturing Processes.

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Manufacturing Process Technology - II

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