This course aims to help learners make informed decisions on PCB layer ordering, pouring, and stackup. The learning outcomes include understanding when to pour copper on signal layers, managing EMI problems, optimizing routing techniques, and selecting the appropriate number of layers for a PCB. The course covers topics such as transmission lines, grounding strategies, cross-coupling, and the significance of reference planes. The teaching method involves a combination of theoretical explanations and practical examples. This course is intended for individuals involved in hardware design, PCB layout, or electronics engineering seeking to enhance their PCB stackup and layering skills.
How to Decide on Your PCB Layer Ordering, Pouring and Stackup - With Rick Hartley
Overview
Syllabus
Intro
Transmission Lines
EMI Problems
Routing Ground
Changing Layers
Reference Planes
Why We Had an EMI Problem
Crosscoupling
Six Layer Board
Four Layer Board
Two Layer Board
Eight Layer Board
Ten Layer Board
Taught by
Robert Feranec
